Partial replacement of partially defective memory devices

ABSTRACT

The partial replacement of partially defective integrated circuit devices, such as memory devices, is disclosed. In one embodiment, the data lines coupled to different sections of the memory array of a memory device have inserted in series therein normally closed links. If a section is found to be defective, then the link for the data line coupled to the section is opened. This permits a repair device to be coupled to the memory device such that only the defective section is replaced. The address and control lines of the repair device are coupled to their counterpart lines of the memory device. However, a data line of the repair device is coupled to a data line of the memory device only if the data line of the memory device is coupled to a defective section.

This application is a continuation of U.S. Ser. No. 08/916,846, filed Aug. 22, 1997, now U.S. Pat. No. 5,920,513.

FIELD OF THE INVENTION

The present invention relates generally to integrated circuit devices and more particularly to the partial replacement of partially defective integrated circuit memory devices.

BACKGROUND OF THE INVENTION

Technological advances have permitted semiconductor integrated circuit memory devices to comprise significantly more circuit elements in a given silicon area. Reducing and eliminating defects in the circuit elements has, however, become increasingly more difficult with the increased number of circuit elements. To achieve higher population capacities, circuit designers strive to reduce the size of individual circuit elements to maximize available die real estate. The reduced size makes these circuit elements increasingly susceptible to defects caused by material impurities during fabrication.

Relying on zero defects in the fabrication of integrated circuit memory devices is an unrealistic goal, however. Therefore, redundant circuit elements are provided on the devices to reduce the number of scrapped devices. If a primary circuit element of a device is determined to be defective, a redundant circuit element is substituted for the defective primary circuit element. Substantial reductions in scrap are achieved by using redundant circuit elements without substantially increasing the cost of the device.

However, occasionally a defective circuit element of a device cannot be repaired by using a redundant element also within the device, or such repair is economically or logistically unfeasible. For example, a single bit failure may be serious enough that it is not internally repairable. In this and other situations, the entire memory device may be replaced by a redundant device. There are drawbacks to this approach, however. Even if the memory device is only partially defective, replacing it with a redundant device means that many of the operational elements are not used and thus wasted. Furthermore, the redundant device must itself be completely operational, or otherwise the replacement will not be successful.

Complete replacement of a defective memory device with a redundant device may therefore be economically undesirable in that a nearly operational device must be scrapped and replaced by a completely operational device. For these reasons, and for other reasons stated below which will become apparent to those skilled in the art upon reading and understanding the specification as disclosed herein, there is a need for the replacement of a partially defective integrated circuit device without having to completely replace the partially defective device. That is, there is a need to partially replace the defective device such that use is still made of many, most or all of the operational elements of the partially defective device.

SUMMARY OF THE INVENTION

The above-mentioned problems and other problems are addressed by the present invention, which will be understood by reading and studying the following specification. The present invention relates to the partial replacement of partially defective integrated circuit memory devices. A memory device is described which has one or more links having an initial closed configuration, wherein each link is coupled to a data line coupled to a section of the memory array. Each link is configured to open to permit replacement of just the section of the memory array coupled to the data line to which the link is coupled.

In particular, in one embodiment of the invention, a multi-chip module includes a plurality of memory devices mounted on a substrate and a plurality of data lines, each coupled to a memory device. A normally closed link is coupled to each data line. If one of the memory devices is partially defective, the appropriate link is opened. This is the link that is coupled to the data line which is coupled to the defective section of the memory device. A partially or completely operating memory device is coupled to the module at a repair site to replace only the defective section.

The operable sections of the partially defective memory device thus remain in use and are not wasted. Furthermore, the replacement memory device may itself be partially defective, since it is not completely replacing the other memory device. This is economically advantageous because memory devices that might otherwise be scrapped may serve as replacement devices, and in any case completely operable replacement devices are not required. Still other and further aspects, advantages and embodiments of the present invention will become apparent in the following description and by reference to the following drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1(a) is a block diagram of a typical memory device in conjunction with which an embodiment of the invention may be implemented;

FIG. 1(b) is a block diagram showing in more logical detail the memory array of the memory device of FIG. 1(a), according to an embodiment of the invention;

FIG. 2 is a block diagram of a normally closed link for a data line of a section of the memory array of a memory device, according to one embodiment of the invention;

FIG. 3 is a diagram of a multi-chip module according to an embodiment of the invention;

FIG. 4 is a diagram of another multi-chip module according to an embodiment of the invention;

FIG. 5 is a diagram showing in more detail the partially defective device and the repair device shown in FIG. 4; and,

FIG. 6 is a method illustrating the partial replacement of a partially defective device in one embodiment of the invention.

DETAILED DESCRIPTION OF THE DRAWINGS

In the following detailed description of the preferred embodiments, reference is made to the accompanying drawings which form a part hereof, and in which is shown by way of illustration specific preferred embodiments in which the inventions may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention, and it is to be understood that other embodiments may be utilized and that logical, mechanical and electrical changes may be made without departing from the spirit and scope of the present inventions. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present inventions is defined only by the appended claims.

The present invention provides for the partial replacement of partially defective memory devices. A typical memory device in conjunction with which an embodiment of the invention is implemented is shown in FIG. 1(a). Memory device 10 includes memory array 12, control circuit 14, input/output buffers 16, and address decoder 18. Memory array 12 includes a plurality of memory cells organized into rows and columns. The memory cells are accessed in response to an address signal provided on the address lines A0 . . . AN running to address decoder 18, which includes both row and column decoder circuitry. Input/output buffers 16 are provided for bi-directional communication via the data communications lines DQ1 . . . DQN running out of buffers 16. Control circuit 14 regulates the memory device operations in response to controls signals including, but not limited to, a Clock (CLK), a Row Access Strobe (RAS*), a Column Access Strobe (CAS*), a Write Enable (WE*), and a Clock Enable (CKE).

Memory array 12 is shown in more logical detail in FIG. 1(b). The memory array is divided into planes 20, 22, 24 and 26. Each of the planes corresponds to a particular data line (i.e., DQ1, DQ2, DQ3 or DQ4). Each of the planes is a separate section of the memory array. The separate sections are shown as different planes to better illustrate the organization of the memory cells of the array. This does not, however, necessarily correspond to the actual physical construction of the array. Each data line can access only those memory cells within the plane of the array to which it corresponds. Where one or more memory cells within a particular plane or section are defective, the section is said to be defective. As described herein, the present invention provides for replacement of only those sections of the memory array of a memory device that are defective with a repair memory device.

As will be appreciated by those skilled in the art, the present invention is not limited to any particular type of memory device or repair memory device. In one embodiment, the devices are dynamic random-access-memories (DRAMs), including those available from Micron Technology, Inc., of Boise, Id., as part numbers MT4LC4M4D42TC2-6TC (for the memory device) and MT4C4D42SC2-6TRA (for the repair device). In other embodiments, the devices are static random-access-memories (SRAMs), flash memories, synchronous dynamic random-access-memories (SDRAMs), extended-data-out random-access-memories (EDO RAMs), and burst-extended-data-out random-access-memories (BEDO RAMs), as those skilled in the art will appreciate.

A block diagram of a normally closed link for a data line of a section of the memory array of a memory device is shown in FIG. 2. Data line 28 is representative of each of the data lines shown in FIG. 1(a) and FIG. 1(b). Data line 28 has inserted in series therein normally closed link 30. Link 30 is normally closed in that it has an initial closed configuration such that it permits electrical current to travel through data line 28. Link 30 is configured to open such that when link 30 is open (that is, link 30 is in an opened configuration), no electrical current can travel through data line 28. Therefore, the section of the memory array to which a data line is coupled may be disabled by opening the normally closed link for the data line. This opens the data line and does not permit electrical current to travel to or from that section of the array.

As will also be appreciated by those skilled in the art, the present invention is not limited to any particular type of normally closed link. In one embodiment, the link is a standard polysilicon fuse or resistor link. The fuse comprises a polysilicon conductor approximately 1μ thick, which is fabricated such that in its normal state there is a complete electrical path through the fuse. A high power laser is used to open the electrical path by evaporating a portion of the polysilicon. In another embodiment of the invention, a burst of high current is asserted to the data line to open the path by blowing the fuse.

A block diagram of a multi-chip module according to an embodiment of the present invention is shown in FIG. 3. Multi-chip module 32 may be a single in-line memory module (SIMM), or any other type of multi-chip module. Multi-chip module includes substrate 34, with bus 36 and memory devices 38, 40, 42, 44,46,48, 50 and 52 mounted thereon. Bus 36 permits coupling of module 32 to a computer or other device receptive to the module. Substrate 34 also includes space for a maximum of two repair devices to be mounted thereon. These are shown as repair sites 54 and 56.

The control lines (e.g., CLK, RAS*, CAS*, WE*, and CKE), the address lines (e.g., A0 . . . AN), and the data lines (e.g., DQ1 . . . DQN) of each of memory devices 38, 40, 42, 44, 46, 48, 50 and 52 are coupled to bus 36 to permit communication between the devices and the bus. However, for sake of clarity, only the data lines for each of the memory devices are shown. Each data line includes a normally closed link inserted in series therein. For example, memory device 38 has data lines with normally closed links 58, 60, 62 and 64. As has been explained, each of the normally closed links permits the individual enablement of a section of the memory array of a memory device. As shown in FIG. 3, none of the links are opened. All the sections of the memory arrays of all the memory devices are enabled.

However, if one or more of the sections are defective, then one or two repair devices are mounted at the repair sites to replace the defective sections. This is shown in FIG. 4, which is a block diagram of a multi-chip module according to an embodiment of the invention. As compared to FIG. 3, the data lines for all the memory devices except device 38 are not shown for sake of clarity. Multi-chip module 32 in FIG. 4 has repair device 66 mounted to substrate 34, at the location specified as repair site 54 in FIG. 3. While links 58 and 62 of memory device 38 remain closed in FIG. 4, links 60 and 64 are open, as shown by dotted lines. This means that the sections of the memory array of device 38 to which links 60 and 64 are coupled via data lines cannot receive communications to or from bus 36. They are effectively disabled, even though the remainder of memory device 38 is operable (i.e., the sections of the memory array to which links 58 and 62 are coupled via data lines).

The control lines (e.g., CLK, RAS*, CAS*, WE*, and CKE) and the address lines (e.g., A0 . . . AN) of repair device 66 are each coupled to the corresponding control and address lines of memory device 38 (not shown in FIG. 4). Furthermore, one data line of repair device 66 is coupled to each data line of memory device 38 having a link that is open. Thus, one data line of device 66 couples the data line of device 38 having link 60, and another data line of device 66 couples the data line of device 38 having link 64. Insofar as repair device 66 has other data lines, they are not used (i.e., not connected). The data lines of memory device 38 having links that are open--i.e., the line with link 58 and the line with link 62--do not have a data line of memory device 66 coupled thereto.

Referring now to FIG. 5, a block diagram illustrating memory device 38 and repair device 66 in more detail is shown. The DQ1 pin of device 38 has closed link 58; therefore, the DQ1 pin of device 66 remains uncoupled. Similarly, the DQ3 pin of device 38 has closed link 62; therefore, the DQ3 pin of device 66 remains uncoupled. However, the DQ2 pin of device 38 has opened link 60; therefore, the DQ2 pin of device 66 is coupled to the DQ2 port of bus 36. Similarly, the DQ4 pin of device 38 has opened link 64; therefore, the DQ4 pin of device 66 is coupled to the DQ4 port of bus 36. All other pins of the devices are coupled to the bus (not shown in FIG. 5), such that corresponding address and control lines of the devices are coupled to one another.

Thus, the sections of the memory array of memory device 38 corresponding to data lines DQ2 and DQ4 are defective, while the sections of the memory array of device 38 corresponding to data lines DQ1 and DQ3 are operative. Rather than replacing device 38 entirely, repair device 66 only replaces those sections of device 38 that are defective. The section of the memory array of repair device 66 corresponding to data line DQ2 of device 66 replaces the section of the memory array of device 38 corresponding to data line DQ2 of device 38. Similarly, the section of the array of device 66 corresponding to data line DQ4 of device 66 replaces the section of the memory array of device 38 corresponding to data line DQ4 of device 38. The functionality of data lines DQ2 and DQ4 is performed by device 66, while the functionality of data lines DQ1 and DQ3 is performed by device 38.

Because all the lines of device 66 other than data lines are coupled to their corresponding lines of device 38, when bus 36 receives a command and corresponding address, both device 38 and repair device 66 process the command. If the command corresponds to a section of the memory related to DQ1 or DQ3, device 38 provides the output, since its DQ1 and DQ3 lines are coupled to bus 36, while the DQ1 and DQ3 lines of device 66 are not. Conversely, if the command corresponds to a section of the memory related to DQ2 or DQ4, device 66 provides the output, since its DQ2 and DQ4 lines are coupled to bus 36, while the DQ2 and DQ4 lines of device 38 are not due to links 60 and 64 having been opened.

Because the sections of the memory array of repair device 66 that correspond to data lines DQ1 and DQ3 of repair device 66 are not coupled at all, these sections do not have to be operable for device 66 to successfully partially replace device 38. That is, repair device 66 may itself be a partially defective device. So long as it has two operable sections within the memory array to replace the two defective sections of the memory array of device 38, repair device 66 is adequate. This means that otherwise scrap memory devices may still be used as repair devices in conjunction with the present invention, providing for a great economical advantage.

Referring now to FIG. 6, a method according to one embodiment of the invention is shown. In step 68, a defective section of the memory array of a memory device is identified. The present invention is not limited to any particular manner in which the defective section is identified. However, in one embodiment, a logic one is written to each memory cell within the section, and then the memory cell is read. If at least one memory cell does not return a logic one when read, the section is defective.

In step 70, the normally closed link coupled to the data line for that section is opened. Again, the present invention is not limited to any particular manner in which the link is opened. In one embodiment of the invention, as has been described, the link is opened by exposure to a high power laser (i.e., an external heat source). In another embodiment of the invention, as has also been described, the link is opened by assertion of a high current to the data line to which the link is coupled in series.

Finally, in step 72, a repair device is connected to the memory device such that just the defective section of the memory device is replaced. The pins of the repair device corresponding to the address and control lines are coupled to their counterpart pins of the memory device. The data line of an operative section of the memory array of the repair device is coupled to the data line of the defective section of the memory array of the memory device. The data lines for the other sections of the memory array of the repair device are not coupled at all. These sections do not have to be operable.

Although specific embodiments have been illustrated and described herein, it will be appreciated by those of ordinary skill in the art that any arrangement which is calculated to achieve the same purpose may be substituted for the specific embodiment shown. This application is intended to cover any adaptations or variations of the present invention. Therefore, it is manifestly intended that this invention be limited only by the following claims and equivalents thereof. 

I claim:
 1. A multi-chip module comprising:a substrate having at least one repair site; a plurality of memory devices mounted to the substrate, each memory device having a memory array, the plurality of memory devices comprising at least one repair memory device situated in the repair site and at least one partially defective memory device; a plurality of data lines, each line coupled to a section of each memory array; a plurality of normally closed links, each link coupled to a corresponding data line, wherein a normally closed link is openable by exposure to an external heat source to permit replacement of a defective section of the memory array in a partially defective memory device by a working section of the memory array in a repair memory device, the defective section being coupled to the data line to which the link is coupled.
 2. The multi-chip module of claim 1, wherein the memory device is selected from the group consisting of dynamic random-access memory, static random-access memory, EDO random-access memory, and flash memory.
 3. The multi-chip of claim 1, wherein each of one or more pins of the partially defective memory device is couple to a corresponding pin of the repair memory device.
 4. A method for repairing a partially defective memory device, comprising:identifying a defective section of the memory device; opening a link coupled to a data line coupled to the defective section of the memory device, including applying an external heat source to the link sufficient to burn away the link; and, connecting a repair device to the memory device to replace just the defective section, including connecting each of one or more pins of the repair device to a corresponding pin of the memory device by coupling the data line of the defective section of the memory device to a data line of an operative section of the repair device.
 5. The method of claim 4, further comprising disposing the repair device in a repair site.
 6. A memory system comprising:a substrate having at least one repair site; at least one repair memory device having a repair memory array with one or more operating sections, the repair memory device being mounted on the repair site and having repair data lines coupled to the corresponding operating sections; at least one partially defective memory device mounted on the substrate, the partially defective memory device having a memory array, the memory array having one or more defective sections; data lines with links, each data line coupled to a section of the partially defective memory array, wherein all links on data lines coupled to defective sections are open and each such data line is coupled to a repair data line of the corresponding operating section of the repair memory device.
 7. The memory system of claim 6, wherein the links are openable by assertion of sufficient current to the data line to which the link is coupled.
 8. The memory system of claim 6, wherein each link is openable by exposure to an external heat source.
 9. The memory system of claim 6, further comprising a bus to which repair data lines and data lines with links are coupled.
 10. The memory system of claim 6, wherein the repair memory device is a partially working memory device.
 11. The memory system of claim 6, wherein each memory device is selected from the group consisting of dynamic random-access memory, static random-access memory, EDO random-access memory, and flash memory.
 12. A method for repairing a partially defective memory device, the method comprising:providing a substrate having at least one repair site; providing at least one partially defective memory device mounted on the substrate and at least one repair device mounted on the repair site, the repair device having a plurality of operating sections, the partially defective memory device having each of its sections coupled to a data line coupled to a link; identifying a plurality of defective sections of the partially defective memory device; opening links coupled to the data lines corresponding to the defective sections; and connecting each data line corresponding to a defective section of the partially defective memory device to an operating section of the repair device.
 13. The method of claim 12, wherein connecting each data line corresponding to a defective section of the partially defective memory device is accomplished by connecting each data line to a repair data line, each repair data line coupled to each operating section of the repair memory device.
 14. The method of claim 13, further comprising providing a bus to accomplish connecting each data line corresponding to a defective section of the partially defective memory device to the repair data lines.
 15. The method of claim 12, wherein opening links includes asserting sufficient current to the data lines to open the links.
 16. The method of claim 12, wherein opening links includes applying heat from an external heat source to the links sufficient to burn away the links. 